Our Programs
From Training to Employment
National Semiconductor Excellence Program (NSEP)
1-month industry readiness training with job placement opportunities.
Feb 2025 intake
now open!
Global Semiconductor Exchange Program (GSEP)
2 to 3-month immersive training with top-tier international semiconductor companies abroad.
Apr 2025 intake
now open!
February 2025 Intake (Application deadline: 24th Jan 2025)
Application for National Semiconductor Excellence Program (NSEP)
The National Semiconductor Excellence Program (NSEP) is a transformative 4-week training initiative designed to fast-track Year 3 and Year 4 undergraduates, fresh graduates, and new hires from Electrical & Electronics (E&E), Computer Science (CS), and related disciplines into high-demand roles in Malaysia’s semiconductor and supply chain industries.
Why Join NSEP?
Hands-on Training: Gain practical experience in Integrated Circuit (IC) design, covering both Digital and Analog tracks.
Industry Expertise: Learn from industry-leading experts and enhance your readiness for high-demand roles.
Exclusive Placement Opportunities: Access 600+ job vacancies with Malaysia’s leading semiconductor companies.
Capstone Project Showcase: Present your skills and innovation to industry leaders at Demo Day.
Program Structure
Intensive Training Tracks
Introduction to IC Design Methodology and Verilog HDL
Verification with VCS
Logic Synthesis with Design Compiler
Design for Test
Front-End Low Power Implementation
Static Timing Analysis with PrimeTime
SystemVerilog Testbench
Physical Implementation with ICC II
Mini Project
Presentation and Evaluation
Program Timeline
Cohort: February 2025 Intake
Duration: 25 days, 9 AM – 4 PM
Eligibility Criteria
Open to:
Year 3 and Year 4 undergraduates
Recent graduates
New hires in E&E, CS, or related fields
Prerequisite: Foundational knowledge in semiconductor and IC design
Selection Process:
Applicants will complete an assessment evaluating their understanding of:
Digital Logic
Analog Circuits
General Programming
- Semiconductor Electronics
Program Deposit Details:
- To ensure commitment and a smooth enrollment process, the following refundable deposit is required for program participation:
- National Semiconductor Excellence Program (NSEP)
A refundable deposit of RM1,000 is required. This deposit will be returned in full upon successful completion of the program.
- National Semiconductor Excellence Program (NSEP)
- Please note that while the programs are fully funded (excluding accommodation and transportation), this deposit ensures participant commitment and adherence to program requirements.
What You Will Gain
Comprehensive Skills: From front-end architecture design to back-end physical implementation
Certifications: Industry-recognized credentials upon program completion
Networking Opportunities: Connect with top semiconductor employers and peers
April 2025 Intake (Application deadline: 28th Feb 2025)
Application for Global Semiconductor Exchange Program (GSEP)
The Global Semiconductor Exchange Program (GSEP) is an 8- to 12-week immersive training initiative designed to equip Malaysia’s top engineering talents with cutting-edge skills in semiconductor technology. Through collaborations with leading institutions in Shenzhen and Hangzhou, GSEP bridges the gap between academia and industry, providing participants with hands-on experience in IC design, manufacturing, and testing. This program is an essential step toward developing Malaysia’s semiconductor ecosystem in partnership with global leaders.
Why Join GSEP?
Gain Global Expertise: Collaborate with industry leaders from Shenzhen and Hangzhou in advanced IC design and verification.
Hands-On Training: Experience practical sessions on the latest tools and methodologies for semiconductor design and testing.
Career Opportunities: Access a robust talent pipeline connecting you with top semiconductor companies in Malaysia and APAC.
Exclusive Industry Insights: Learn from technical experts specializing in System-on-Chip (SoC), precision ADCs, and large-scale semiconductor systems.
Program Structure
Duration: 2 months (in Shenzhen, China) or 3 months (Malaysia)
Location: Either in Shenzhen, China, or locally at Puchong Financial Corporate Centre (PFCC).
Key Modules:
- IC Design: Digital circuit design, simulation processes, debugging methods.
- Layout Skills: Master foundational skills in IC layout design.
- Manufacturing & Packaging: Gain virtual training on packaging processes.
- Testing Proficiency: Learn testing principles, digital tester operations, and chip testing methodologies.
- Capstone Project: Showcase your skills during a demo day for industry leaders.
Class Size: Limited to 30 participants for personalized attention.
Eligibility Criteria
Who Can Apply?
- Undergraduates and fresh graduates in Electrical & Electronics (E&E), Computer Science, or related fields.
- Newly employed individuals eager to enhance their semiconductor knowledge.
Prerequisite:
- Strong foundation in analog circuits, digital circuits, and C programming.
- Completion of an assessment evaluating knowledge of semiconductor concepts.
What You Will Gain
Skill Development: Master advanced techniques in IC design, verification, and layout.
Certification: Receive industry-recognized certification upon completion.
Global Network: Build connections with leading global institutions and peers.
- Career Advancement: Secure opportunities with semiconductor companies across Malaysia and APAC
Enroll Now!
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