Semiconductor Week
12 - 13 November 2025 | CoPlace 9
Supported by
Semiconductor Week 2025 (12–13 November) brings together Tektronix and CADFEM to spotlight the latest in semiconductor innovation—free to attend, limited seats available, with certificates provided.
Program Details
Date & Time
12 & 13 November
9 - 4 PM
Venue
ASEM, CoPlace 9
Target Audience
From Students to
Working Engineers
Requirement
STEM
Background
TekDay Selangor
Unleashing the Full Potential of Next-Generation Semiconductor Technologies
Artificial Intelligence, mobility, and green energy are redefining the semiconductor landscape. From intelligent embedded systems to wide-bandgap materials like Silicon Carbide (SiC) and Gallium Nitride (GaN), innovation is driving higher performance and energy efficiency. With nearly 80 years of expertise, Tektronix empowers engineers and researchers to accelerate breakthroughs in next-generation semiconductor design and testing.
Admission is FREE — reserve your seat today and be part of the future of semiconductor innovation.
- Introduction to Wide Bandgap Semiconductor and GaN's Application for Artificial Intelligence and Computing
- Wide Bandgap Semiconductor: From Materials Research to Failure Analysis
- NPI Showcase - 7 Series DPO and MP5000 Series
- Latest High Speed Compliance Solutions Journey in the AI World
- High Power DC Solutions for Future Mobility and AI Data Center
Ansys Multiphysics for Semiconductor
This one-day professional training introduces participants to structural, thermal, and electrical analysis using ANSYS tools — with emphasis on semiconductor and electronic system applications. The program blends theoretical fundamentals with practical demonstrations using HFSS-IC, Icepak, Mechanical, and SIwave tools, complemented by a quick overview of Redhawk and Totem for chip-level power and reliability analysis.
- Overview of ANSYS Multiphysics for Semiconductor Applications
- Introduction to HFSS-IC and Chip–Package Co-Design Concepts
- Icepak: Thermal Modeling Overview
- Mechanical: Reliability Analysis Overview
- Introduction to Redhawk and Totem – Power & Reliability Overview
- HFSS-IC: Chip–Package EM Co-Design Exercise
- Icepak: Thermal Simulation and Heat Dissipation Study
- SIwave: Power Integrity and Crosstalk Evaluation
- Mechanical: Reliability Analysis – Warpage Simulation
Venue
Advanced Semiconductor Academy of Malaysia
Level 2, CoPlace 9
Block 2320, Century Square, Jalan Usahawan, Off,
Persiaran Multimedia, Cyberjaya, Selangor
63000
Malaysia